http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I221862-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_069a92549123806a5d654dc036a676e9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0950e9df7f0e1b73efee1bda859951ad |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F1-00 |
| filingDate | 2000-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2004-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2cc79bf03ee8b3ce0545899392a26475 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_633fd21d7b85c7075559d18952865967 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_73ffea2aecb7c005fc6c7e9eeaa5ac99 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c6f63b3374664acfbd4bd01512be9483 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e482db2074741a6c51560743fda80901 |
| publicationDate | 2004-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I221862-B |
| titleOfInvention | Apparatus and method for plating a substrate, and method and apparatus for electrolytic treatment |
| abstract | This invention particularly relates to an apparatus and a method for electro plating a substrate to fill a metal such as copper in the fine wiring pattern (recess) formed on the semiconductor substrate. The apparatus has a substrate holder 36 to hold the substrate in horizontal for rotation with the surface to be electro plated oriented upwardly; a seal member 90 butting against the peripheral of surface to be plated of the substrate held by said holder 36 to seal it water tightly; and a cathode electrode 88 connecting with the substrate to conduct electricity thereto. A cathode 38 rotates integrally with substrate holder 36. An electrode arm 30 adapted to move vertically and horizontally is disposed over said cathode 38 and is provided downwardly with an anode 98. An electroplating liquid injection means is provided for introducing the liquid into the space between the surface to be plated of the substrate and the anode 98 of electrode arm 30 near said surface. With the arrangement, the electroplating treatment and the incidental treatment can be done in a single unit. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11211267-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I623997-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I757604-B |
| priorityDate | 1999-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 40.