http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I221331-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5dabfc7998cca69e04571256e5cb4e80 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-34 |
| filingDate | 2003-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2004-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_05815ca5c22c10af1476aea519ee2d31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_84eaa9b81e542dd8590594e44610aa34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6ae06cf13e2e811be9d900b5ec663ac2 |
| publicationDate | 2004-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I221331-B |
| titleOfInvention | Heat sink module plate with slot structure and method for fabricating semiconductor package substrate with the heat sink |
| abstract | A heat sink module plate with a slot structure and a method for fabricating a semiconductor package substrate with the heat sink are proposed. A substrate module plate composed of a plurality of substrate units and a heat sink module plate are provided. The heat sink module plate is composed of a plurality of heat sink units corresponding to the substrate units of the substrate module plate, and a plurality of slots are formed around the heat sink units. The substrate module plate is mounted on the heat sink module plate and then singulated along the slots of the heat sink module plate to form substrate strips with a plurality of heat sink units or a plurality of substrate units each mounted with an individual heat sink unit. |
| priorityDate | 2003-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 21.