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filingDate 2002-06-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2004-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2004-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I221197-B
titleOfInvention High density planar electrical interface
abstract An apparatus including a substrate having a plurality of through holes and a plurality of cables, including wires and/or coaxial cables, extending through respective ones of the plurality of through holes of the substrate. Each of the cables comprises a conductor and terminates about a surface of the substrate such that the conductors of respective ones of plurality of cables are planarly aligned and available for electrical contact. A system including a cable interface extending through respective ones of a plurality of through holes of a body of the interface; an interconnection component comprising a first plurality of contact points aligned with respective ones of conductors of the plurality of cables and a second plurality of contact points aligned to corresponding contact points of a device to be tested. Also, a method of routing signals through the conductors of the plurality of cables between electronic components.
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Total number of triples: 28.