http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I220170-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5a1908f384755fc487f647a70c84e147 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
| filingDate | 2002-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2004-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_58133bba1fd270ba49280caa7c323a75 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e221e6779be15828da7dfb9109f15af6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d3cd2eb630b2512a382ac7c19e8ec370 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_baaaa8e9e66c61d5fff844c9ee2b7107 |
| publicationDate | 2004-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I220170-B |
| titleOfInvention | Process of probing a wafer |
| abstract | A process of probing a wafer includes the following steps. First, the wafer is provided with a passivation layer and at least one contact pad, both of which are on an active surface of the wafer. The passivation layer has an opening exposing the contact pad. Micro-contamination material is absorbed on the contact pad and on the passivation layer. This micro-contamination can cause overkill issue during circuit probing (CP test). The micro-contamination material is removed by an argon sputtering process in this invention. The overkill issue of CP test could be eliminated by adding in this physical clean. |
| priorityDate | 2002-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.