patent/TW-592871-B

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-592871-B

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filingDate	2001-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2004-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8fb7e412d2bf8c5bb2c648040fbbb574 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e0c5954eb9e1f8f3081b296870536e94 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d7bd2a3872a7b0e612ec77c6b970e731 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_60b508a0ce984ba3c04863143e39abd4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_766e781967f825ae72cebc28116d37b1
publicationDate	2004-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	TW-592871-B
titleOfInvention	Solder foil and semiconductor device and electronic device
abstract	Solder foil formed by rolling metal particles such as Cu particles and a material containing Sn particles as solder particles is suitable for high-temperature-side solder-joining in a temperature-step solder-joining, and a semiconductor device and an electronic device obtained by using such solder joining are excellent in mechanical characteristics and reliability.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I630850-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11259408-B2
priorityDate	2000-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24261
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID457707758
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http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID104727
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID9989226
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID449176413
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419524915

Total number of triples: 123.