http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-590876-B

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filingDate 2001-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2004-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a080c248c34b09f5c7408362735a695f
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publicationDate 2004-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-590876-B
titleOfInvention Label for in-mold molding and resin molding with the label
abstract This invention provides a label for in-mold molding, which comprises a thermoplastic resin film base layer and a heat sealable resin layer, and is characterized in that the label for in-mold molding has a centerline mean roughness on a surface of the heat sealable resin layer between 0.5 to 5 mum, and gas permeability of the label between 10 to 20,000 s. By using the label for in-mold molding of this invention with respect to all kinds of shapes of resin molding, it is able effectively suppresses the generation of blisters in making resin molding with label.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110167738-A
priorityDate 2000-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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