| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e415f6f1eeb8706d299ea086326248bf |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76861
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76868 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28 |
| filingDate |
2001-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2004-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b96e82003b1604c05f5b940692af0e76
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c02d5830e16dae57724258caed2fba43
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_07d5f51c916ee7062cccfa7107a408db
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bba4d38a08fabffebde2e55d24c16e07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9364218ea54f0906e0588c0a81ee5580 |
| publicationDate |
2004-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-589413-B |
| titleOfInvention |
Seed layer repair method |
| abstract |
Disclosed are methods of repairing metal seed layers prior to subsequent metallization. Such repair methods provide metal seed layers disposed on a substrate that are substantially free of metal oxide and substantially free of discontinuities. A method of providing a metal seed layer substantially free of discontinuities disposed on a substrate comprising the steps of contacting a metal seed layer having discontinuities disposed on the substrate with an acidic electrolyte bath and subjecting the bath to a current density in the range of the 0.002 to 0.1 A/cm<2>, wherein the acidic electrolyte bath comprises one or more acids, one or more copper compounds present in the range of 5 to 75 g/L of copper metal, one or more suppressors and water, wherein the acidic electrolyte bath is free of accelerators. |
| priorityDate |
1999-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |