http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-587408-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_865149c168de69426bf7624b2d422dcc |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C1-144 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C17-006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C17-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C7-041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C1-142 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C7-049 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C17-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C7-04 |
| filingDate | 2000-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2004-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_469c9a8a236c43a635fa4addbc0adf3e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_29edcea69e1ed601d2b8c13bbdf2a459 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0a3926c390a18afd7e37d8720c2af65d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2521ca2b00746c48f1fb07a8bb715fcc |
| publicationDate | 2004-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-587408-B |
| titleOfInvention | A structure and its manufacturing method for polymeric circuit protection device |
| abstract | The present invention is related to a polymeric circuit protection device and its manufacturing method. A highly conductive composite material and a conductive composite material having positive temperature coefficient thermister resistance characteristic are stacked to form a plate-shaped composite material, in which metal foils are bonded on both the upper and the lower parts for use as the electrodes and are pressed to form a sandwiched lamination layer material. After the linkage reaction, the resin material in the composite material layer is linked. Through the use of printed circuit board process, the electrode grooves are etched and solder mask is screen-printed to manufacture the insulation layer, so as to isolate different electrodes disposed on the same side. The highly conductive composite material has a conductivity value 20 times higher than that of the conductive composite material to assure that the current conduction between the conducted electrodes of the internal plate-shaped composite material mainly comes from the highly conductive composite material part but not from the conductive composite material portion having resistance characteristic of thermister. |
| priorityDate | 2000-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 40.