http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-584899-B

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filingDate 2002-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2004-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_39654b0e3027abc77c4e997d616c1eb6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6fc252ecc77eb002e8148104d27a63f9
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publicationDate 2004-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-584899-B
titleOfInvention Planar metal electroprocessing
abstract The present invention relates to a method for forming a planar conductive surface on a wafer. In one aspect, the present invention uses a no-contact process with electrochemical deposition, followed by a contact process with electrochemical mechanical deposition. In another aspect the no-contact process with electrochemical deposition uses a solution tailored to this no-contact process, and the contact process with electrochemical mechanical deposition uses a different solution tailored to this contact process.
priorityDate 2001-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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