| abstract |
To provide an insulating resin composition excellent in shock resistance, heat resistance, having high adherence with plating metals, capable of selective etching due to permanganate used in the plating process, and suitable for use in the insulating layer of a multilayer printed wiring board. The insulating resin composition is that in the resin composition containing cross-linking elastic polymer capable of polymerization by light or heat, containing 3-10 parts by weight cross-linking elastic polymer based on 100 parts by weight resin component (inclusive of the monomer except the cross-linking elastic polymer), and is characterized by the cross-linking elastic polymer having a carboxylic group and dispersed in the range of the average secondary particle diameter of 0.5 to 2 mum. |