http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-583261-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2002-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2004-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9b408a4fe242c580a6f0b6aad937fd31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_41fb4eff18a8c542e53afdc82384aeca |
| publicationDate | 2004-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-583261-B |
| titleOfInvention | Thermosetting resin composition and its use in epoxy resin molding material and semiconductor device |
| abstract | The present invention provides a thermosetting resin composition, having combined characteristics of fast curing property and high storage stability with high fluidity, and an epoxy resin molding material, and furthermore a semiconductor device using this material. More particularly, the present invention provides a thermosetting resin composition comprising, as the essential ingredients, (A) a compound having 2 or more epoxy groups in 1 molecule, (B) a compound having 2 or more phenolic hydroxyl groups in 1 molecule, and (C) a phosphonium compound represented by the general formula (1), and an epoxy resin molding material containing these ingredients, and further a semiconductor device encapsulated with a cured product thereof: wherein R1, R2, R3 and R4 may be the same as or different from one another and each is a monovalent, organic group having an aromatic ring or a heterocyclic ring or a monovalent, aliphatic group and is bonded to the phosphorus atom to form a P-C bond; P is phosphorus atom; H is hydrogen atom; Y is a group formed by releasing 1 proton from a proton donor having trivalency or a higher valency; and n means a value of 0.2-2. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107075088-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107075088-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I687449-B |
| priorityDate | 2000-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 90.