| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0502026221d2320a18d38480f4472e13 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-4913
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49128
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49169
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49401
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49346 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1646
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-14137
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1639
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1642
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1629
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1628
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1631
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1601 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41J2-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11B5-127
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41J2-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41J2-05 |
| filingDate |
2003-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2004-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_18331a832e682f8f2f3f807eef3dfbc7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c624065067f367c8538bc9a2ac522f81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5e7165ace9bd27c68a8a40230e46da98 |
| publicationDate |
2004-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-580435-B |
| titleOfInvention |
Method for fabricating a monolithic fluid eject device |
| abstract |
A method for fabricating a monolithic fluid eject device. The method includes providing a substrate with a patterned sacrificial layer thereon. A patterned support layer is formed on the substrate and covers the sacrificial layer. A patterned resistive layer is formed on the support layer as heating elements. A patterned insulating layer having a heating element contact via and a first opening is formed on the support layer. A patterned conductive layer is formed on the support layer and fills the heating element contact via as a signal transmitting circuit. A patterned protecting layer having a signal transmitting circuit contact via and a second opening corresponding to the first opening is formed on the substrate covering the insulating layer and conductive layer. A manifold is formed by wet etching the back of the substrate and exposes the sacrificial layer. A chamber is formed by removing the sacrificial layer in the wet etching process. Finally, an opening connecting the chamber is formed by etching the support layer along the second opening. |
| priorityDate |
2003-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |