http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-565955-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ed76131ddda07950fa9ba87fba15eeb6 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-00 |
| filingDate | 2002-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2003-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5cedd248d3ddaa00ad80741ef68cd397 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_374c5d5074dbe2887fd229e5c7dac6e4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a77c5f898a8f082c295a272b29f1fa34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_62a1fe3beb42af6eeafb8ef7ab77e09e |
| publicationDate | 2003-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-565955-B |
| titleOfInvention | Sub-mount for light emitting diode |
| abstract | A sub-mount for light emitting diode (LED) is disclosed. The sub-mount is a metal substrate, which is coated with a nickel layer and a gold layer. The metal substrate has a slot to divide the metal substrate into two portions. One portion may have a bowel-like reflector formed therein to support a LED chip. After wire bonding and molding with transparent resin to protect the bonding wires[/or wire]. The exposed portions of the metal substrate can provide an excellent oxidation-resist characteristic without further tin or tin-lead deposited process. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I420713-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I426594-B |
| priorityDate | 2002-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 28.