| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7f961fe8c8d1f1b4507f909c92cd9566 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-061
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68345
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49128
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48465
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4688
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4644
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48228
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4857
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0058
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4682
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4614 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate |
2002-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2003-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_12c2ad4987ee0b7d00da7e5a2c10ae93
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_045a40ce4ddfdcd8a58598cd0e7b40a5 |
| publicationDate |
2003-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-564527-B |
| titleOfInvention |
Hybrid interconnect substrate and method of manufacture thereof |
| abstract |
A hybrid interconnect substrate and method of manufacture thereof are disclosed. The hybrid interconnect substrate is formed by bonding a carrier substrate to a multi-level interconnect structure formed on a handle substrate. The multi-level interconnect structure is formed by deposition, photolithography and etching processes used in semiconductor processes. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I562275-B |
| priorityDate |
2002-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |