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filingDate 2002-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2003-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-563201-B
titleOfInvention Dry developing method
abstract A dry developing method leads processing gas between parallel flat plate electrodes installed in a vacuum processing container 102 and forms the plasma of the processing gas by applying a high frequency power to the electrodes for drawing a photoresist formed on a processed body 150 by a first step of plasma-processing the resist on an etched layer 152 having an already developed upper layer resist 156 containing silicon and a lower layer resist 154 installed in contact with the lower layer of the upper layer resist 156, in which the lower layer resist 154 is processed by a first process for plasma-processing by using the mixed gas of carbon monoxide gas and oxygen gas, and a second step for plasma-processing by using the mixed gas of nitrogen gas and hydrogen gas to perform a dry etching to the photoresist formed on the processed body 150. Accordingly, it is able to perform a dry developing to the photoresist in a highly accurate and highly efficient manner.
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