http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-557554-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38ed56a4b4e8e2315b2b3308bffedb3f |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28 |
| filingDate | 2002-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2003-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_62473bed553d104075bc1747654e6dc3 |
| publicationDate | 2003-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-557554-B |
| titleOfInvention | Flip chip package process |
| abstract | A fluxless flip chip package process is disclosed. A fluorine-contained plasma is used to transfer the oxide covered the solder bump to oxyfluoride with low melting point. Then, spin the under-fill over the solder bump and turn the chip having solder bump covered under fill over to align the substrate. Finally, a thermal process is performed to adhere the solder bump and the substrate each other. The under fill cure and the re-flow process of the solder bump may be performed together. |
| priorityDate | 2002-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 48.