http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-556034-B

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9afd626b14ef4bfd1a0cbc8b5bae6a13
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-136236
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-136227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1248
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-136
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-1368
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-136
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-1362
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-77
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G09F9-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-84
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-336
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-786
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-1333
filingDate 2002-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2003-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ed52aa8c40d3fac9a9caf43d8e3500b1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f24303260cc1e20c62764ee8925a1fc9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_63d5343d4d6dc8d19330ac41c0cb0327
publicationDate 2003-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-556034-B
titleOfInvention Method for manufacturing active matrix substrate
abstract In a step for forming a contact through hole in a protective film that covers a thin film transistor (TFT) to connect a source electrode of the TFT and a pixel electrode to each other, location of a later-formed contact through hole is designed to be apart not less than 2.0 mum from location of the opening of an overcoat layer, which opening is formed on the protective film. This construction forces the opening of a novolac type photosensitive resist to be positioned inside the location of the opening of the overcoat layer and therefore, the contact through hole formed in the protective film is able to have a tapered cross sectional profile that is never affected by the opening of the overcoat layer, allowing for stable connection between the source electrode and the pixel electrode.
priorityDate 2001-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/taxonomy/TAXID190227
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419577462
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID11729320
http://rdf.ncbi.nlm.nih.gov/pubchem/anatomy/ANATOMYID190227
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID448674543
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID449266279
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559581
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID297
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID15913
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23940

Total number of triples: 39.