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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7abe9d2f1a007e6d6da7db760d21374e
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8242
filingDate 2002-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2003-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd9ebfb37a8b3f6803e6198d857f6798
publicationDate 2003-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-554495-B
titleOfInvention A self-aligned trench-type DRAM structure and its manufacturing methods
abstract A self-aligned trench-type DRAM structure comprising a self-aligned DRAM capacitor structure and a self-aligned DRAM transistor structure are disclosed by the present invention, in which the self-aligned DRAM capacitor structure comprises a deep-trench capacitor region and a shallow-trench-isolation region being defined by a spacer technique and the self-aligned DRAM transistor structure comprises a scalable gate-stack region and a common-drain region being defined by another spacer technique. The self-aligned trench-type DRAM structure is used to implement two contactless DRAM arrays. A first-type contactless DRAM array comprises a plurality of metal bit-lines integrated with planarized common-drain conductive islands and a plurality of highly conductive word-lines. A second-type contactless DRAM array comprises a plurality of metal word-lines integrated with planarized conductive-gate islands and a plurality of common-drain conductive bit-lines.
priorityDate 2002-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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