http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-546408-B

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classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-42
filingDate 2002-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2003-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6b6d55c7af0bf8e808814c0d35a8a2e0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e620ae1bacbc1ce4ee8eaaa177360d7
publicationDate 2003-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-546408-B
titleOfInvention Displacement gold plating solution
abstract The present invention provides a non-cyanide displacement gold plating solution with which even an electroless nickel-boron plated or electrolytic nickel plated substrate can be subjected to displacement gold plating with good adhesion properties and high solderability. The displacement gold plating solution in accordance with the present invention contains 0.01 to 1.0 g/L (expressed in terms of gold concentration) of sodium gold sulfite or ethylene diamine complex of sodium gold sulfite, 10 to 100 g/L of sulfite, 5 to 50 g/L of organic carboxylic acid or salt thereof, and 5 to 50 g/L of ethylene diamine tetraacetic acid or salt thereof, and has a pH value in the weak acid range of 4.5 to 6.
priorityDate 2001-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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