http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-543110-B

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-24
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D3-28
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-20
filingDate 1999-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2003-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ebdefe4b67d949d56a03b6a52d338ef5
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publicationDate 2003-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-543110-B
titleOfInvention Rubbing pad
abstract The invention relates to a rubbing pad which is characterized by having a microgum A hardness of more than 80 degrees, closed bubbles with an average bubble diameter of less than 1000 mum, and a density in the range of 0.4-1.1, and comprising a polymer made from the polymerization of polyurethane and a vinyl compound. While the rubbing pad of the present invention is used in flatting local irregularities of a semiconductor substrate, the rubbing rate is high, the global step difference is small, the dishing of metal wirings is not easy to happen, the clogging and the permanent set in fatigue of the top layer part are not easy to occur, and the rubbing rate is stable.
priorityDate 1998-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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