http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-539920-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_65aa22bcc8da87a6c99b46e5dc8b28eb |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0388 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-033 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate | 1999-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2003-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_11f5b0b79e9184ad9f53a92b465e369e |
| publicationDate | 2003-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-539920-B |
| titleOfInvention | Photosensitive resin composition and photoresist ink for manufacturing printed wiring boards |
| abstract | A photosensitive resin composition having photocurability, thermosetting property, and developability with water or a diluted alkali aqueous solution, includes the following components (A) to (E). That is, the component (A) is a water-soluble photosensitive resin selected from the group consisting of a first resin obtained by introducing a styryl pyridinium group into a polyvinyl alcohol polymer, a second resin obtained by introducing a styryl quinolinium group into the polyvinyl alcohol polymer, and a third resin obtained by adding N-alkylol (meth) acrylamide to the polyvinyl alcohol polymer. The component (B) is a photosensitive prepolymer having carboxyl group and at least two ethylenically unsaturated groups in molecule. The component (C) is an epoxy compound having at least two epoxy groups in one molecule. The component (D) is a photopolymerization initiator. The component (E) is water. This photosensitive resin composition will be preferably used as a photoresist ink for manufacturing printed wiring boards such as a solder resist ink and a marking ink, developable-type ink for manufacturing color-filter pixels, or an ink for manufacturing color-filter protective films. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102199282-A |
| priorityDate | 1998-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 200.