| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0ddb9f3656270bc5410be3679322fead |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0554
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2379-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0793
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-122 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-12 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-12 |
| filingDate |
2002-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2003-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7f73b279f1aa4b588d1c18d25869f62c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2f3bddcf1993269cf527d20fd28fb708
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aefb6ed4e3bb837993b47ed62d72a689 |
| publicationDate |
2003-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-535467-B |
| titleOfInvention |
Wiring board, manufacturing method thereof, polyimide film for use with wiring board, and etchant for use according to said method |
| abstract |
A process comprises etching an organic insulating layer comprising a polyimide film with an etchant, wherein the polyimide film is made of a polyimide comprising repeating units represented by the following general formula (1) and the etchant is an alkaline one which comprises a hydroxyalkylamine, an alkali metal hydroxide compound, and water and preferably further contains an aliphatic alcohol. Thus, via holes and through-holes of desired shapes can be efficiently formed in the insulating organic layer to produce a wiring board. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112375570-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112375570-B |
| priorityDate |
2001-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |