Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1837840b0d7f1d216335a0331a4bd15a http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7acd9416af412b5972feb55a5e652ea2 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-032 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
filingDate |
2000-07-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2003-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_68ac18c741b46197f28c65dadc85b79d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_beb2b1fb3b0cb3da829066677083f5cf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c5bd229b62259b32e1e5ae52702c167 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97a98cb60f494037eeed4986ba2535e6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5ea69d6c95ab0de8aaa9ca19b4f89425 |
publicationDate |
2003-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-535466-B |
titleOfInvention |
Insulating material for printed wiring board |
abstract |
An insulating material for printed wiring boards characterized by comprising: a silane modified resin composition containing an alkoxy group containing silane modified resin obtained by a reaction between a hydroxyl group containing resin that is at least one kind selected from the group consisting of a hydroxyl group containing epoxy resin and a phenolic resin and an alkoxysilane partial condensate. |
priorityDate |
2000-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |