http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-527610-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f5658c026ed0552b2dd23d9df4c5d93 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C7-02 |
| filingDate | 2001-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2003-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_91fea0b89b60f48c7a29cefc4dd36707 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f2e43d2c6cff1896bda2d475bab49e1e |
| publicationDate | 2003-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-527610-B |
| titleOfInvention | Structure of SMT recoverable over-current protection device and its manufacturing method |
| abstract | There are provided a structure of SMT recoverable over-current protection device and its manufacturing method. The method comprises using an extruder or the like to squeeze out a bar-shaped line body with polymer of positive temperature (PPTC) material over-coated on the central conductor; next, cutting the bar-shaped line body into small segmented chip with a desired suitable length; then, staining or over-coating the two ends of the chip formed in the above step for a suitable distance and retaining the non-coated central segment; electroplating a conductive layer on the non-coated central segment of the chip; next, over-coating the chip with a second insulating layer and retaining a suitable width close to one end for exposing the inner conductive layer; furthermore, polishing the top surface of the other end of the chip to expose the PPTC material over-coated on the central conductor, the conductive layer and the insulating layer on the cross-section of the tail end; then, over-coating the two ends of the chip with conductive glue (such as silver glue), and electroplating Ni and Sn/Pd to form a conductive glue layer; wherein one end of the conductive glue layer directly contacts the central conductor, and the other end of the conductive glue layer contacts the conductive layer while the central segment has a plurality of insulating layers, conductive layer and central conductor. |
| priorityDate | 2001-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 28.