http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-526386-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d75d1a4caed60a9316608ed9c231546c |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S430-116 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S430-121 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4676 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0387 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y30-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y15-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-037 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-037 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 |
| filingDate | 2000-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2003-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4eac27cd57baee0fc98902c3d2db3ec4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_313508e19e02e48a4a17b116964ed34f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6c1c0204fdaea4cbf8d5efc12a4646d3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6c8bfb57a0740eae94fee50fff0ad76c |
| publicationDate | 2003-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-526386-B |
| titleOfInvention | Photosensitive resin composition, print wiring substrate, substrate for embarking semiconductor chip and semiconductor device, and processes for producing print wiring substrate, substrate for embarking semiconductor chip and semiconductor device |
| abstract | The subject of the present invention is to provide a negative type photosensitive resin composition which can be employed to the productions of semiconductor elements, circuit wiring boards, etc. and can form a resin layer with high sensitivity and resolving power as well as excellent heat-resistant properties. Also provided are a print wiring substrate using said photosensitive resin composition, a substrate for embarking semiconductor chip and a semiconductor device, as well as processes for producing a print wiring substrate using said photosensitive resin composition, a substrate for embarking semiconductor chip and a semiconductor device. The solutions are a photosensitive resin composition comprising a polyamic acid or polyimide, which contains a substituent having a cis-diene structure in the side chain, and a oxygen sensitizer; a substrate and a semiconductor device obtained by applying said composition and irradiating radiation rays to form a fine pattern; as well as a process for forming a fine pattern comprising applying said composition, and oxi-condensation polymerizing and crosslinking the cis-diene structure with single oxygen produced by irradiating radiation rays on the oxygen sensitizer. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I454504-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I686425-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I422979-B |
| priorityDate | 1999-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 107.