Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9fc0a00eab3a757e8324b1e887d7ba97 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05568 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-2081 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-243 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0949 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81801 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0315 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49811 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3436 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3452 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 |
filingDate |
2001-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2003-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_703b8453fb144931f57b472d83e360fe http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c47a534aaeae11f8b041e3c09c1f7f1c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cb593f11e0338dafee9c5d5aec0cb07c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_67dab2543e6c4137c6ecfb2a1049a108 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fab63df397d6b8f5ffdb7453d5a40101 |
publicationDate |
2003-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-519728-B |
titleOfInvention |
Apparatus for connecting a semiconductor die to a substrate and method therefor |
abstract |
A pad area of a substrate (50) includes a conductive trace (52) formed on the substrate (50) having a first surface area, the first surface area being of a first solderability. A conductive pad (56) is formed on the first surface area of the conductive trace (52). The conductive pad (56) has a second surface area, the second surface area being of a second solderability. The second solderability is greater than the first solderability. Because of the different solderabilities, a solder bump (46) on the semiconductor die (40) can be reflowed and connected to the second surface area without using a soldermask (28) to contain the melted solder on the second surface area. |
priorityDate |
2000-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |