| abstract |
This invention provides a tape carrier, without generation of crack, for semiconductor and the manufacturing method of this tape carrier, and semiconductor using said tape carrier and manufacturing method for this semiconductor. Metal films are formed on both sides of a flexible insulated tape 1, wherein a metal wiring layer 2 for the mounting of semiconductor chip on one side by the formation of a protective film, by etching, and by the removal of said protective film, while the insulated tape is exposed at the desired position of the other side. Said metal wiring layer side is protected by a protective film made of resin. A peer hole 3 is formed on said exposed portion of insulated tape by etching. A copper ring 6 is formed by the removal of said metal film of exposed portion from the protective film by the etching process for a resin protective film formed by said peer hole 3 and at least a part of outside edge of said peer hole 3. Thus, the protective film formed on both sides of the insulated tape is removed. |