| abstract |
A manufacturing method of the passivation metal on the surface of integrated circuit is disclosed, which provides an integrated circuit constitution comprising a substrate and more than one chip on it, a chip capable of being coupled to the substrate by plural ways such as wire-bonding or flip-chip, and an encapsulant to be at least passivated on the chip and the adjacent substrate. A metal spray layer passivated on the surface of part of the non-conductive region is formed by spraying thereby forming the integrated circuit in the way of metal spray. Before spraying the metal layer, a protection film can be added selectively for protection. The thickness of the metal spray layer can be controlled for varying easily, which can achieve good heat dissipation and EMI prevention effect, so as to maintain the normal operation of the integrated circuit chip. |