http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-517367-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ba0fe93fa8eea04c101216eaedc50fb0 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 |
| filingDate | 2001-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2003-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2f3f3589e81d3645b5a4cf82d2d77979 |
| publicationDate | 2003-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-517367-B |
| titleOfInvention | Processing method of plain-top gold bump |
| abstract | A processing method of plain-top gold bump is disclosed, which is provided to proceed etching the gold bump. Since the etch rate of protruded portion of gold bump is faster than that of the plain portion, so the removal rate of the protruded portion is faster than that of the plain portion, and thereby the top surface of the gold bump is planarized. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7651886-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7538020-B2 |
| priorityDate | 2001-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 28.