| abstract |
A metal layer is formed on each surface of topside substrate electrodes on a substrate. Another metal layer is formed on each surface of chip electrodes on a function element chip. Both ends of vertical coil springs are connected to the topside substrate electrodes and the chip electrodes through the metal layers, respectively. In this way, the topside substrate electrodes are connected to the chip electrodes through the vertical coil springs by means of flip hip bonding. Thereby, there is provided a semiconductor device having flip chip bonding structure, a production method thereof, a coil spring cutting jig and a coil spring guiding jig applied thereto, wherein: it is possible to prevent faulty connection caused by the thermal expansion difference between a function element device and a substrate; after a function element device and a substrate that are connected through a connection formation is separated from each other because a faulty point has been found in an electrical inspection after the tentative connection, it is possible to easily reconnect the function element device and the substrate; the configuration is simple and the packaging cost is low; and even if a high-power-consumption-type function element device is applied, it is possible to realize low thermal resistibility and high reliability of connection. |