http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-508661-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-20 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 |
| filingDate | 2000-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2002-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8c64b3ea34549fe09e64bf7bab53da5b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e064bb1e5eed204cf419adedf73ec576 |
| publicationDate | 2002-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-508661-B |
| titleOfInvention | Method and apparatus for forming metal layer on substrate |
| abstract | The present invention generally provides an apparatus and a method for electrochemical deposition of a metal layer on a substrate that achieves high throughput and minimal edge exclusion. The invention provides a method for forming a metal layer on a substrate comprising: depositing a full coverage seed layer over the substrate; electrochemically depositing a metal layer over the seed layer; and removing any exposed seed layer from an annular edge portion of the substrate. The invention also provides an apparatus for forming a metal layer on a substrate comprising: an electrochemical deposition cell having a cathode contact member adapted to contact a peripheral portion of a substrate at less than about 3mm from an edge of the substrate, a processing cell adapted to remove any exposed seed layer on a peripheral portion of the substrate; and a transfer chamber having a robot adapted to transfer a substrate between the electrochemical deposition cell and the processing cell for removing exposed seed layer. |
| priorityDate | 1999-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 34.