| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38beba0459076ff48db83799f7e33c24 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12472
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12569
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12611
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12438
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0307
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0723
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-1291
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C2222-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-384
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-605
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C28-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F15-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D11-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C22-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C22-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C28-00 |
| filingDate |
2001-01-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2002-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ba5a2d0fb67e8a1f6a059a8d7697eb2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_acafd4809e8ca2af554c7559505f3509
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2c187544aee82e50489a37c7f8a311f1 |
| publicationDate |
2002-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-503670-B |
| titleOfInvention |
Surface treated copper foil, its manufacture method and copper-clad laminate using the same |
| abstract |
This invention provides a surface-treated copper foil excellent in moisture resistance and capable of consistently attaining a copper foil circuit of a line width of 0.2 mm whose degradation rate loss of resistance against hydrochloric acid is below 10% as measured on a copper pattern prepared from the copper foil by bringing out the maximum effect of the silane coupling agent employed in brass-plated anti-corrosive copper foil. In order to attain these objects, the invention provides a surface-treated copper foil for producing printed circuit boards whose surface has been subjected to nodular treatment and anti-corrosion treatment, in which the anti-corrosion treatment includes forming a zinc-copper brass plating layer on the surface of the copper foil; forming an electrodeposited chromate layer on the zinc-copper (brass) plating layer; forming a silane-coupling-agent-adsorption layer on the electrodeposited chromate layer; and drying the copper foil for 2-6 seconds as the copper foil reaching the temperature between 105 and 200 DEG C. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10990157-B2 |
| priorityDate |
2000-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |