| abstract |
The present invention discloses using a resin package for packaging multiple semiconductor chips, and an installation method concerning the simplicity for testing each semiconductor chip, and also for applying in different types of MCP and system LSI. The method is to independently interconnect one signal output terminal of the first semiconductor chip in the single package with the first external terminal of the semiconductor device, and to independently interconnect one signal input terminal of the second semiconductor chip with the second external terminal of the semiconductor device. By connecting the first and second external terminals of the semiconductor device from outside of the semiconductor device, the specification of connection can be completed between the signal output terminal and the signal input terminal. |