Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4edd4e526605dbd18b513b4b30d19ab2 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-05042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10329 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01015 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01031 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1423 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02166 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05009 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-351 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01004 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-808 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-80 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-336 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-337 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-316 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28 |
filingDate |
2001-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2002-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ee4c316737d77418bbbde5dba7b7f712 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4e6719c9fed20d1fb3747cc6e1890ec4 |
publicationDate |
2002-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-495990-B |
titleOfInvention |
Method for making compound semiconductor device |
abstract |
This invention provides a method for making compound semiconductor device to overcome the problem of frequent break of substrates during bonding because the substrate and a silicon nitride film are hard when a pad structure which is formed by layering a first pad electrode and a second pad electrode on the silicon nitride film is adopted for a compound semiconductor device. In a step for leaving a resist layer 58 on an intended gate electrode 69 and adhering an oxide film 61 on the surface of a source region 56 and a drain region 57 and on the peripheral edge of an intended pad region 59, a pad oxide film 62 is laid under a first pad electrode 70 and the peripheral edge of a second pad electrode 77. In this way, the method for manufacturing the compound semiconductor device by which the pad structure suppressing the spread of the depletion layer at its peripheral edge is realized without increasing the number of manufacturing steps. |
priorityDate |
2000-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |