http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-495982-B

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5d7576285d411d00c697e07270d2814a
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-783
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-78615
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-786
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
filingDate 2001-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2002-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d27d2b45becd6e95c5522002c80c18a4
publicationDate 2002-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-495982-B
titleOfInvention Semiconductor device
abstract In an isolation region of an SOI substrate (1), an STI (10) is formed in a silicon layer (4). In an end portion of the isolation region, a p<SP>+</SP>-type impurity diffusion region (11) is selectively formed, being buried in part of an upper surface of the STI (10), in an upper surface of the silicon layer (4). In an element formation region of the SOI substrate (1), a body region (15) which is in contact with a side surface of the impurity diffusion region (11) is formed in the silicon layer (4). A tungsten plug (14) is in contact with the impurity diffusion region (11) with a barrier film (13) interposed therebetween, and in contact with part of an upper surface of a gate electrode (9) and a side surface thereof with the barrier film (13) interposed therebetween. With this structure obtained is a semiconductor device which makes it possible to avoid or suppress generation of an area penalty which is generated when a gate-body contact region is formed inside the silicon layer in an SOI-DTMOSFET.
priorityDate 2000-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23964
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425762086
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23960
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID453632010
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419577459
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID82895
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419520982
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID157241427
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415776239
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5461123
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559541
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID188318

Total number of triples: 30.