| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7f961fe8c8d1f1b4507f909c92cd9566 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01074
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48644
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48639
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48666
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48664
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05639
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05664
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05647
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05644
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-49
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49431
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01009
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05666
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05554
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05553
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48647
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02166 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-485 |
| filingDate |
2001-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2002-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ced180aa8127298ec22bbd0bff25e675
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_061319cc400f461f6430c949633e2f32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d79eb63e7bbd50929a45dc7f362dd8b3 |
| publicationDate |
2002-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-490839-B |
| titleOfInvention |
Conducting wire layer structure |
| abstract |
A kind of conducting wire layer structure for use as the conducting wire layer structure under the bonding pad in the chip is disclosed in the present invention. The chip has a substrate and can be divided into the center core circuit and the peripheral bonding pad region. The conducting wire layer structure includes multiple upright trapezoid conducting wire regions and multiple inverted trapezoid conducting wire regions, which are mutually separated and are arranged inside the bonding pad region. Multi-layered dielectric layers and patterned multi-layered conducting layers are respectively provided and are interlaced mutually to overlap on the substrate, in which the width of the conducting wire layer in the upright trapezoid conducting wire region is wider as the conducting wire layer is more close to the substrate while it is narrower as the conducting wire layer is far away from the substrate. The width of the conducting wire layer in the inverted trapezoid conducting wire region is narrower as the conducting wire layer is more close to the substrate while it is wider as the conducting wire layer is far away from the substrate. The present invention on the one hand is capable of enhancing structure strength for the conducting wire layer and the dielectric layer, and on the other hand can make the power source conducting wire that communicates with the periphery of the bonding pad region have even larger conducting wire cross-section area. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I460835-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I566352-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9098473-B2 |
| priorityDate |
2001-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |