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filingDate 2000-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2002-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2002-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-473859-B
titleOfInvention Forming method of copper interconnection and semiconductor wafer with copper interconnection formed thereon
abstract In a wafer edge neighbouring region 26, the circumference end part of a silicon oxide film 8 is set in an outer position than the circumference end part of a silicon oxide film 3 and thereby a structure in which polishing remains 21 generated in forming a copper interconnection comprising a copper film 6 and the like are covered with the silicon oxide film 8 is attained.
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