| abstract |
The present invention relates to a bump forming method, soldering pretreatment method, soldering method, bump forming device, soldering pretreatment device and soldering device. Plasma generating mean (21) generates a hydrogen-containing plasma under a low pressure in a vacuum chamber (12) while being supplied with a process gas from a gas supplying means. A soft solder alloy on an object (11) to be processed and held by object exposing means (15) is exposed to the hydrogen-containing plasma. Simultaneously with the exposure or after the exposure, the soft solder alloy is reflowed in a vacuum by heating means (36). Thus, using the inexpensive soft solder alloy on the object (11), a bump-shaped electrode terminal having an excellent reliability is formed without a cleaning step because no flux is used. |