http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-466154-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ddbd9538efce6e134d471b912946264e |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate | 1998-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2001-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c723d4d11a56fcbd6afffcfc3972822b |
| publicationDate | 2001-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-466154-B |
| titleOfInvention | Method for chemical mechanical polishing in combination with spin coating |
| abstract | A method for chemical mechanical polishing in combination with spin coating includes providing a semiconductor substrate with a non-planar surface, a dielectric layer is formed upon the semiconductor substrate, which is substantially used as a sacrificial layer or a stop layer, a layer of spin coating material is formed upon the dielectric layer by spin coating process, which includes a silicate glass layer and/or a polymer layer, and finally proceeding a planarization process by the chemical mechanical polishing. |
| priorityDate | 1998-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 16.