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filingDate 2000-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2001-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de157633d23a0afdd8cac5b12fcc0b65
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publicationDate 2001-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-461110-B
titleOfInvention Ferroelectric memory with ferroelectric thin film having thickness of 90 nanometers or less, and method of making same
abstract A coating of liquid precursor containing a metal is applied to a first electrode (122), baked on a hot plate in oxygen ambient at a temperature not exceeding 300 DEG C for five minutes, then RTP annealed at 675 DEG C for 30 seconds. The coating is then annealed in oxygen or nitrogen ambient at 700 DEG C for one hour to form a thin film of layered superlattice material (124) with a thickness not exceeding 90 nm. A second electrode (126) is applied to form a capacitor (128), and a post-anneal is performed in oxygen or nitrogen ambient at a temperature not exceeding 700 DEG C. if the material is strontium bismuth tantalate, the precursor contains u mole-equivalents of strontium, v mole-equivalents of bismuth, and w mole-equivalents of tantalum, where 0.8 ≤ u ≤ 1.0, 2.0 ≤ v ≤ 2.3, and 1.9 ≤ w ≤ 2.1.
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