Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15173 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-30107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1532 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3011 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05599 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15153 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-49 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1517 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49171 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-4913 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85399 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-552 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-552 |
filingDate |
2000-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2001-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1bf9c27d10e78f524d98a56ae9311344 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_73275967a3e786e534280a0ad879fa84 |
publicationDate |
2001-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-457656-B |
titleOfInvention |
Ball grid array module |
abstract |
A Plastic Ball Grid Array electronic package of the Cavity Down type for use in HF application. The present invention allows to reduce the overall thickness of the package, by tailoring the different mechanical portions of the module structure (interconnection balls, grounded stiffener thickness). A thin dielectric layer is laid on a metal (e.g. copper) stiffener. A chip is attached on the same side of the dielectric layer and the electrical connections between the chip and the pads are done with metallic traces running on the surface of the dielectric layer. The external rows of balls are not connected to the circuit traces; they are electrically connected to the metal stiffener to realise the lateral shielding for the HF applications. The connection between the balls and the metal stiffener (which acts as the ground plane) is done by means of photovias. One of the more important aspects of the present invention is the dramatic reduction of the parasitic impedance. |
priorityDate |
1999-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |