| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6af1aac0717028a45913e80d9e05fad8 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-49
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16152
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16251
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49171
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3738
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-562
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4334
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3128 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-433
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 |
| filingDate |
2000-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2001-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b52fd09552e1d96ccfad136ddb06960
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d3be782cb441d3902e2682727300a330 |
| publicationDate |
2001-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-454321-B |
| titleOfInvention |
Semiconductor package with heat dissipation structure |
| abstract |
A semiconductor package with heat dissipation structure is disclosed, which comprises a semiconductor device bonded to a substrate. The semiconductor chip has an active surface for plural bonding wires to be bonded on it and electrically connects the semiconductor chip and the substrate. The active surface is bonded to a lid made of the material whose thermal expansion coefficient is close to the semiconductor chip through an adhesive layer, so as to reduce the effect of thermal stress to the semiconductor chip and effectively avoid the crack of the semiconductor chip. Thereby to enhance the heat dissipation efficiency generated from the active surface of the semiconductor chip, and prevent the moisture from the exterior from condensing on the active surface of the semiconductor chip. A heat dissipation sheet is disposed on the substrate. The heat dissipation sheet has a top surface to expose the encapsulant wrapping the semiconductor chip and lid, and the heat dissipation sheet spaces from the lid top for a proper distance to avoid the heat dissipation sheet from touching and pressing the semiconductor chip. It can effectively reduce the thickness of the packaging resin between the heat dissipation sheet and the semiconductor substrate at the same time, so as to promote the heat dissipation efficiency. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105742192-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105742192-B |
| priorityDate |
2000-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |