http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-454304-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_debdce2919e710d16b43b47334c6da14 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78 |
| filingDate | 2000-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2001-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5a5352d57f122050474df9ebe6e541d3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9360c193d6f3b6272879557f5be89a89 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a51176d78254ffdbe3e407448a040e79 |
| publicationDate | 2001-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-454304-B |
| titleOfInvention | Method for cutting wafers |
| abstract | A method for cutting wafers is applied to cut wafers. On the wafer, there are plural devices, and plural dicing channels exist in between devices. The mask on the wafer is used as the etching barrier. The mask can be photo mask, silicon nitride or the etching barrier layer formed by silicon oxide or photoresist. The mask exposes the dicing channel. Then, an etching method is used to etch these dicing channels in order to cut this wafer. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7518217-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103594335-A |
| priorityDate | 2000-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 57.