http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-454286-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6af1aac0717028a45913e80d9e05fad8 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2000-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2001-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_65d7dc7dab1fd77d74772ff21a415faf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1a4144adce1d6a6055f7120574bc022b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3dd81062c98bea4d0da74873ad0f102d |
| publicationDate | 2001-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-454286-B |
| titleOfInvention | Manufacturing method of testing connection points on the peripheral bond pads of flip chip |
| abstract | There is provided a manufacturing method of testing connection points on the peripheral bond pads of flip chip, which can be used on fine-pitch peripheral bond pad formed on a flip-chip semiconductor to form the testing connection points. Therefore, the circuit testing instrument dedicated to the peripheral bond pad can perform a circuit test procedure to the internal circuit of the semiconductor chip via the testing connection points. The manufacturing method of testing connection points on the peripheral bond pads of flip chip is characterized in using a NiV/Cu metallization structure layer to form the required testing connection points. Also, an under bump metallization structure layer is formed on this area array pads for being used as the bonding pads of the solder bumps. The manufacturing method of testing connection points on peripheral bond pads of flip chip has an advantage in using low resolution photolithography etching apparatus to define the photoresist mask while the aluminum peripheral bond pads are not damaged by corrosion. |
| priorityDate | 2000-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 26.