http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-454031-B

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_70ec63d39d6704bacc5c7068c93ded43
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-02
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J153-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-32
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J153-02
filingDate 1996-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2001-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb41c370f56b24d06df3538219f4d450
publicationDate 2001-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-454031-B
titleOfInvention Low viscosity hot melt disposables adhesive composition
abstract The present invention provides a low viscosity, hot melt adhesive composition which is especially suited for use in disposables and is comprised of (a) 100 parts by weight of a blend of (i) a styrene-diene triblock copolymer, hydrogenated or unhydrogenated, having a weight average molecular weight of 20,000 to 175,000 and a polystyrene content of from 10 to 40 % by weight, and (ii) an unhydrogenated styrene-isoprene diblock copolymer having a weight average molecular weight of 10,000 to 30,000 and a polystyrene content of from 10 to 40 % by weight, wherein the diblock copolymer comprises from 60 to 95 % by weight of the blend, and (b) 100 to 275 parts by weight of a tackifying resin which is compatible with the diene blocks. In its preferred embodiment, the invention is the use of SI diblock polymer with a much smaller amount of conventional SEBS or SEPS triblock polymer to produce an extremely low viscosity product which can be processed in the type of equipment presently in use by disposables manufacturers and to be used in disposables assembly applications.
priorityDate 1995-09-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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