http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-449609-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7f9af914ed2fb00cd4f1b8b1a28964e4 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F299-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C70-502 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F283-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-09 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F283-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C70-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L67-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L67-00 |
| filingDate | 1996-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2001-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_434d971f7bb900599753ec3687a3cc4f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8fc09bb4f08e93b20ed252413bdc140b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_772fe27ae8d495d94b36dd6762b8bfd7 |
| publicationDate | 2001-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-449609-B |
| titleOfInvention | Molding compound composition, molding compound containing the same, and method for producing the molding compound |
| abstract | A molding compound composition of the present invention comprises a resin composition, for example, unsaturated polyester, a succinic acid derivative, and a thickening agent such as magnesium oxide, and the moisture content thereof is adjusted in a range of from 0.1 to 0.45 percent by weight. A molding compound comprises the molding compound composition and reinforced fibers such as glass fibers, and the moisture content thereof is adjusted to be in a range of from 0.1 percent to 0.4 percent by weight. As shown in Fig. 1, the molding compound composition has excellent viscosity characteristics since the initial thickening action due to the thickening agent is restrained. Although the viscosity after thickened is lower than that of a conventional composition, the stickiness of the surface of the molding compound composition is reduced. The molding compound composition has high flowability and excellent impregnability, shows an abrupt viscosity increase after impregnation, and is thickened at higher speeds as compared with the conventional composition. |
| priorityDate | 1995-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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