| abstract |
The invention relates to a flux based on inorganic boron and/or halogen compounds for brazing difficult to wet metallic materials with silver- and copper-based solders, which is characterised in that it contains, as an activating addition, based on the total amount of the flux, 0.01-10 wt.% of elemental boron and 0.01-10 wt.% of at least one of the elements Mo, W, Mn, Co, Ni, Pd, Cu or Ag in the form of elements, alloys or compounds. The activating addition brings about a substantial increase in the wettability by the solder, particularly in the case of difficult to wet parent materials. |