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filingDate 2000-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2001-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e55027c14fededdd523c751ca51833d2
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publicationDate 2001-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-444326-B
titleOfInvention Method of making a graded grown, high quality oxide layer for a semiconductor device
abstract A method for making an oxide layer on a silicon substrate produces an oxide layer including graded portions with greatly reduced stress. The method preferably comprises the steps of: growing a first oxide portion by upwardly ramping the silicon substrate to a first temperature lower than a SiO2 viscoelastic temperature, and exposing the silicon substrate to an oxidizing ambient at the first temperature and for a first time period; and growing a second oxide portion between the first oxide portion and the silicon substrate by exposing the silicon substrate to an oxidizing ambient at a second temperature higher than the SiO2 viscoelastic temperature for a second time period. The second oxide portion may have a thickness in a range of about 25 to 50% of a total thickness of the graded oxide layer. The step of upwardly ramping preferably comprises upwardly ramping the temperature at a relatively high ramping rate to reduce any oxide formed during the upward ramping.
priorityDate 1999-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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