http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-441025-B

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_88fc7f9eb617072238851d46591a0c76
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
filingDate 2000-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2001-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8645d0613fd6698494fd843e2b8ecf13
publicationDate 2001-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-441025-B
titleOfInvention Formation method of inter-metal dielectric layer
abstract A formation method of inter-metal dielectric layer only uses SiF4 and O2 to deposit a fluorosilicate glass layer with a low dielectric constant. The method comprises providing a substrate having semiconductor devices; placing the substrate in a reaction device; directing SiF4 and O2 into the reaction device for being used as reaction gas; regulating the gas flow to provide a stable pressure in the reaction device; performing a chemical vapor deposition procedure in the reaction device to form a fluorosilicate glass layer on the substrate.
priorityDate 2000-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 19.