| abstract |
Apparatus (2) for fabricating an integrated circuit (1100), said apparatus comprising; (a) a deposition chamber (2); (b) a substrate (5) located within said deposition chamber, said substrate defining a substrate plane; (c) means (46-1) for producing a mist (66) of a liquid precursor (64); and (d) means (8, 10) for flowing said mist through said deposition chamber substantially evenly across said substrate in a direction substantially parallel to said substrate plane to form a film of the liquid precursor on said substrate, wherein said means for flowing includes a barrier plate (6) disposed in spaced relation above said substrate and substantially parallel thereto, said barrier plate having a smoothness tolerance of 5% of the average distance between said barrier plate and said substrate. |